JCET: Semiconductor Packaging and Testing the State of the Art - видео

Yaojian Lin VP of Engineering and General Manager of RD Center JCET Group Speech Title: Packaging Fundamentals of High-Performance Applications Si node technology in IC scaling is becoming too expensive and associated yield can be problematic and moreover each node does not seem to provide the proportional performance and power benefits. In this context the advanced packaging options have been surfaced out as an alternative. One option is to integrate heterogeneous dies in an advanced package...
Источник видео: RuTube.ru (Лайфстайл)